"Disruption on the Edge of Cloud - Competetive Advantage Through Digital Value Chains" (lataa pdf klikkaamalla kuvaa)
Timo Seppälä, Research Associate at ETLA (The Research Institute of the Finnish Economy) "Ohjelmistot sulautettuna tuotteisiin vai tuotteet sulautettuna ohjelmistoihin?" (lataa pdf klikkaamalla kuvaa)
Tuukka Ahoniemi, Qt, Head of Strategy "From Devices to Platforms - Qt and the Evolution of Embedded Software" (lataa pdf klikkaamalla kuvaa)
11.00 am Panel discussion on the future of Embedded Technology in Finland
Kari Liuska, Etteplan, Senior Vice President, Embedded Systems and Industrial Internet Tuukka Sarkki, Vincit, Director Timo Seppälä, Research Associate at ETLA Tuukka Ahoniemi, Qt, Head of Strategy
12.00 pm lunch
1.00 pm Technical tracks: Tools and HW, Platforms and SW Click on the titles to see the pdf presentations.
Ciklum, established in 2002, is a custom product engineering company with a global presence across 15 countries in 3 continents. We specialize in crafting bespoke digital solutions that push boundaries and transform industries, including full-scale IoT solutions. Whether it's cutting-edge embedded systems, data architecture or IoT, we seamlessly integrate our solutions into your existing infrastructure.
Check Point Software Technologies Ltd. is a leading provider of cyber security solutions to corporate enterprises and governments globally. Check Point Infinity’s portfolio of solutions protects enterprises and public organisations from 5th generation cyber-attacks with an industry leading catch rate of malware, ransomware and other threats.
Analog Devices, Inc. is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world.
EBV Elektronik was founded in 1969 and is one of the leading specialists in European semiconductor distribution. This success is based on the underlying company philosophy, which was developed a long time ago and which still applies today: operational excellence, flexibility, reliability and execution – with the goal of achieving the highest degree of customer satisfaction.
The Rohde & Schwarz technology group develops, produces and markets a wide range of electronic capital goods. With its extensive product portfolio, the company makes an important contribution to a safer and connected world. In the test & measurement, secure communications, networks & cybersecurity and broadcast & media markets, customers worldwide rely on Rohde & Schwarz and its cutting-edge solutions.
Mespek is an industrial electronics company. Our main product areas are embedded modules, industrial computing, test & measurement modules and server management systems (KVM-switches). Besides our domestic customers we have clients also in several countries such as Benelux, China, Estonia, Ireland, Norway, Russia, Sweden, Switzerland, et cetera..
We offer unique and cost-effective customized solutions based on electronic components and systems, as well as standard products from selected manufacturers. We also have own production company for electronics and cabling in Sweden. We have 90 years of experience, deep engagement, knowledge together with trustworthy and effective logistics worldwide. We are ISO 9001 and ISO 14001 certificated.
ECF24 will be organised on May 21 at Maria 01 startup campus in the center of Helsinki. The event will be free of charge for qualified visitors.
This time we´re offering 3 different sponsoring packages: GOLD, SILVER and BRONZE.
♦ GOLD SPONSOR 4500 euros Great visibility on the dedicated ECF site and the ETN newsletters before the conference. A keynote slot. A table top booth with all the benefits of an exhibitor.
♦ SILVER SPONSOR 3000 euros Great visibility on the dedicated ECF site. A presentation slot in the technical programme. A table top booth with all the benefits of an exhibitor.
♦ BRONZE SPONSOR 1750 euros. Table top booth.
To book your place in this 6th annual ECF contact either ETN editor-in-chief Veijo Ojanperä or the sales manager Anne-Charlotte Sparrvik. The space is limited, so please act now.
As before, the attending the event is free for visitors. The registration for the event is open and can be found here.
Veijo Ojanperä Tämä sähköpostiosoite on suojattu spamboteilta. Tarvitset JavaScript-tuen nähdäksesi sen. +358-407072530
Anne-Charlotte Lantz Tämä sähköpostiosoite on suojattu spamboteilta. Tarvitset JavaScript-tuen nähdäksesi sen. +46-734171099
To avoid becoming another victim of the ongoing chip crisis, we had to adapt and explore different ways of designing products. We tried a number of solutions, many of which we plan to continue to use even once this crisis is over. We would like to share these practices that have been helping us during this challenging time.
Embedded & Data Analytics CoE director Milan Piskla and HW engineer David Gustafik, Ciklum
Over the past few months the rise of large language models have brought AI to coffee table discussions all around the world. But what actually is AI? What are the new models capable of and how is AI being utilized in modern cyber security solutions to provide users what they deserve. The Best Security.
Cyber security expert Jarno Ahlström, Check Point Technologies
A snapshot of available and coming 4G and 5G modules and some new features in the latest and coming 3GPP releases. 4G and 5G cellular network deployments : Thoughts from a birds perspective.
The R&S MXO 4 series is the first of a new generation of oscilloscopes that excels in both performance and value. The instruments deliver a once-in-a-decade engineering breakthrough for accelerated insight. They have the world’s fastest real-time update rate of 4.5 million waveforms/s, meaning engineers can see more infrequent events than with any other instrument.
Pasi Suhonen, Application Engineer for Oscilloscopes Nordic and Baltic regions, Rohde & Schwarz
Digital transformation demands for a huge increase of connectivity. Everything gets connected - even across different domains. How can international standards support to master this challenge?Where are we today and how may actual standardization efforts impact future designs and create new platforms? Basically I’m elaborating on a common customer question: What should I build into my next product?
Joachim Preissner, Field Application Engineer, Analog Devices
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